Physical Vapour Deposition sputtering process (PVD)
Physical Vapour Deposition Method (Resistive method and Sputtering method)
Intro to sputtering (process to create clear, conductive coatings)
Lecture 46 : Sputtering
Sputtering is a process whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles, particularly gas ions in a laboratory. It only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies. This process can lead, during prolonged ion or plasma bombardment of a material, to significant erosion of materials, and can thus be harmful. On the other hand, it is commonly used for thin-film deposition, etching and analytical techniques. Sputtering is done either using DC voltage or using AC voltage. In DC sputtering, voltage is set from 3-5 kV and in RF sputtering, power supply is set at 14 MHz. Due to the application of an alternating current, the ions inside the plasma oscillate resulting in an increase in the levels of plasma.