The pull-off test, also called stud pull test is a near-to-surface method in which an adhesive connection is made between a stud and the carrier by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested. The force required to pull the stud from the surface, together with the carrier, is measured. Simple mechanical hand-operated loading equipment has been developed for this purpose. When higher accuracy is required, tests can be performed with more advanced equipment called a bond tester. A bond tester provides more control and possibly automation. Applying the glue automatically and curing with UV light is the next step in automation.